PRODUCT

DINE ENG produces various kinds of automated equipment.

PRODUCT

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T. +82-32-624-3292

E. dine@dineeng.co.kr

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LED Part

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Equipment for measuring and classifying wafer thickness.
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Main composition
  • Loading Part
  • Measurement (indicator)
  • CASSETTE (10EA)
  • Thickness category by cassette (micron unit)
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